Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages

ABSTRACT

Organic electronic packages having sealed edges. More specifically, packages having organic electronic devices are provided. A number of sealing mechanisms are provided to hermetically seal the edges of the package to completely protect the organic electronic device from external elements. A sealant may be implemented to completely surround the organic electronic device. Alternatively, edge wraps may be provided to completely surround the organic electronic device.

CROSS REFERENCE TO RELATED APPLICATIONS

This Application is a Divisional of U.S. patent application Ser. No.10/817,531, which was filed on Apr. 2, 2004, now U.S. Pat. No.8,405,193, which issued on Mar. 26, 2013.

BACKGROUND

A developing trend in circuit and display technology involves theimplementation of organic electronic and opto-electronic devices, whichprovide low cost, high performance alternatives to silicon electronicdevices. One such organic device is the organic light emitting diode(OLED). OLED's are solid-state semiconductor devices, which implementorganic semiconductor layers to convert electrical energy into light.Generally, OLEDs are fabricated by disposing multiple layers of organicthin films between two conductors or electrodes. The electrode layersand the organic layers are generally disposed between two substrates,such as glass or plastic. The OLEDs operate by accepting charge carriersof opposite polarities, electrons and holes, from the electrodes. Anexternally applied voltage drives the charge carriers into therecombination region to produce light emissions. Unlike many siliconbased devices, OLEDs can be processed using low cost, large area thinfilm deposition processes which allow for the fabrication of ultra-thin,light weight lighting displays. Significant developments have been madein providing general area lighting implementing OLEDs.

Conventional OLED devices may implement top and bottom glass substrates.Advantageously, glass substrates generally provide adequate hermeticityto seal the device from exposure to moisture and oxygen that is presentin the atmosphere. Disadvantageously, glass substrates are thick, heavyand relatively fragile. Providing reliable electrical contacts toorganic thin films is made more difficult when the devices are exposedto air and water, which can degrade their electronic properties rapidly.

Another example organic electronic device is an organic photovoltaic(OPV) device. OPVs are solid-state semiconductor devices that implementorganic semiconductor layers to convert light into electrical energy.Disadvantageously, OPVs may also be susceptible to the degradation,durability and manufacturability issues discussed above with respect tothe OLEDs.

To provide more durable and more easily manufacturable devices, theorganic electronic devices may be fabricated on a flexible base materialsuch as transparent, polymeric films or metal foils. Polymeric filmscoated with ultra-high barrier layers and metal foils generally providehermetically acceptable materials on which to build the organicelectronic devices and which may be implemented in roll-to-rollmanufacturing processes. While the metal foils and the ultra-highbarrier coated polymeric films generally provide sufficient protectionfrom moisture and oxygen on the top and bottom surfaces of the organicelectronic device, the edges of the device may still be susceptible tomoisture and oxygen. This may be especially true in roll-to-rollmanufacturing systems. Accordingly, there is continued need for organicelectronic devices, which implement flexible substrates and do notsuffer from permeation of environmental elements through the edges ofthe devices.

BRIEF DESCRIPTION

In accordance with one embodiment of the present techniques, there isprovided a package comprising a flexible substrate comprising apolymeric transparent film; an organic electronic device coupled to thetransparent film; a sealant coupled to the flexible substrate anddisposed about the perimeter of the organic electronic device; and asuperstrate coupled to the sealant and disposed proximate to the organicelectronic device.

In accordance with another embodiment of the present techniques, thereis provided a package comprising: a flexible substrate comprising apolymeric transparent film; an organic electronic device coupled to thetransparent film; a sealant coupled to the transparent film and disposedabout the perimeter of the organic electronic device; and a superstratecoupled to the sealant and disposed proximate to the organic electronicdevice, wherein the superstrate comprises a periphery adapted to wraparound edges of the package such that the periphery of the superstrateis coupled to a side of the flexible substrate opposite the organicelectronic device.

In accordance with yet another embodiment of the present techniques,there is provided a package comprising: a flexible substrate comprisinga polymeric transparent film; an organic electronic device coupled tothe transparent film; a sealant coupled to the transparent film anddisposed about the perimeter of the organic electronic device; asuperstrate coupled to the sealant and disposed proximate the organicelectronic device; and an edge seal coupled to each of the flexiblesubstrate and the superstrate and configured to hermetically sealperipheral edges of the package.

In accordance with still another embodiment of the present techniques,there is provided a package comprising: a first composite substrate,wherein peripheral edges of the first composite substrate are coveredwith a first edge seal; a second composite substrate, wherein peripheraledges of the second composite substrate are covered with a second edgeseal; and an organic electronic device disposed between the firstcomposite substrate and the second composite substrate, wherein thefirst composite substrate is coupled to the second composite substratevia a sealant.

In accordance with a further embodiment of the present techniques, thereis provided a method of fabricating a package comprising: providing aroll of a flexible substrate film; disposing a plurality of organicdevices on the flexible substrate film; providing a roll of metal foil,the roll of metal foil having approximately the same dimensions as theroll of flexible substrate film; disposing a sealant on the metal foilsuch that the sealant is arranged to form a plurality of perimeters,wherein each of the plurality of perimeters is sized to completelysurround the organic devices once the metal foil is coupled to theflexible substrate film; and coupling the metal foil to the flexiblesubstrate film.

DRAWINGS

Advantages and features of the invention may become apparent uponreading the following detailed description and upon reference to thedrawings in which:

FIG. 1 illustrates a cross-sectional view of one embodiment of anorganic electronic package in accordance with the present techniques;

FIG. 2 illustrates a perspective view of one method of fabricating anorganic electronic package in accordance with the present techniques;

FIG. 3 illustrates a cross-sectional view of another embodiment of anorganic electronic package in accordance with the present techniques;

FIG. 4 illustrates a cross-sectional view of yet another embodiment ofan organic electronic package in accordance with the present techniques;

FIG. 5 illustrates a cross-sectional view of an exemplary compositesubstrate that may be implemented in conjunction with the presenttechniques;

FIG. 6 illustrates a cross-sectional view of another exemplary compositesubstrate that may be implemented in conjunction with the presenttechniques; and

FIG. 7 illustrates a cross-sectional view of still another embodiment ofan organic electronic package in accordance with the present techniques.

DETAILED DESCRIPTION

FIG. 1 illustrates an organic package having a flexible substrate 12.The flexible substrate 12 generally comprises a substantiallytransparent film. As used herein, “substantially transparent” refers toa material allowing a total transmission of at least about 50%,preferably at least about 80%, of visible light (i.e., having a wavelength in the range from about 400 nm to about 700 nm). The flexiblesubstrate 12 is generally thin, having a thickness in the range ofapproximately 0.25-50.0 mils, and preferably in the range ofapproximately 0.5-10.0 mils. The term “flexible” generally means beingcapable of being bent into a shape having a radius of curvature of lessthan approximately 100 cm.

The flexible substrate 12 may be dispensed from a roll, for example.Advantageously, implementing a roll of transparent film for the flexiblesubstrate 12 enables the use of high-volume, low cost, reel-to-reelprocessing and fabrication of the organic package 10. The roll oftransparent film may have a width of 1 foot, for example, on which anumber of organic packages may be fabricated and excised. The flexiblesubstrate 12 may comprise a single layer or may comprise a structurehaving a plurality of adjacent layers of different materials. Theflexible substrate 12 has an index of refraction in the range ofapproximately 1.05-2.5, and preferably in the range of approximately1.1-1.6. Further, the flexible substrate 12 generally comprises anyflexibly suitable polymeric material. For instance, the flexiblesubstrate 12 may comprise polycarbonates, polyarylates, polyetherimides,polyethersulfones, polyimides, such as Kapton H or Kapton E (made byDupont) or Upilex (made by UBE Industries, Ltd.), polynorbornenes, suchas cyclic-olefins (COC), liquid crystal polymers (LCP), such aspolyetheretherketone (PEEK), polyethylene terephthalate (PET), andpolyethylene naphtalate (PEN).

To provide hermeticity, the flexible substrate 12 is coated with atransparent bather coating 14 to prevent moisture and oxygen diffusionthrough the flexible substrate 12. The barrier coating 14 may bedisposed or otherwise formed on the surface of the flexible substrate 12such that the barrier coating 14 completely covers the flexiblesubstrate 12. The barrier coating 14 may comprise any suitable reactionor recombination products for reacting species. The barrier coating 14may be disposed at a thickness in the range of approximately 10 nm toabout 10,000 nm, and preferably in the range of approximately 10 nm toabout 1,000 nm. It is generally desirable to choose a coating thicknessthat does not impede the transmission of light through the flexiblesubstrate 12, such as a barrier coating 14 that causes a reduction inlight transmission of less than about 20%, and preferably less thanabout 5%. It is also desirable to choose a coating material andthickness that does not significantly reduce the substrate'sflexibility, and whose properties do not significantly degrade withbending. The coating may be disposed by any suitable depositiontechniques, such as plasma-enhanced chemical-vapor deposition (PECVD),radio-frequency plasma-enhanced chemical-vapor deposition (RFPECVD),expanding thermal-plasma chemical-vapor deposition (ETPCVD), reactivesputtering, electron-cyclodrawn-residence plasma-enhanced chemical-vapordeposition (ECRPECVD), inductively coupled plasma-enhancedchemical-vapor deposition (ICPECVD), sputter deposition, evaporation,atomic layer deposition (ALD), or combinations thereof.

The barrier coating 14 may comprise organic, inorganic or ceramicmaterials, for instance. The materials are reaction or recombinationproducts of reacting plasma species and are deposited onto the surfaceof the flexible substrate 12. Organic coating materials may comprisecarbon, hydrogen, oxygen and optionally, other minor elements, such assulfur, nitrogen, silicon, etc., depending on the types of reactants.Suitable reactants that result inorganic compositions in the coating arestraight or branched alkanes, alkenes, alkynes, alcohols, aldehydes,ethers, alkylene oxides, aromatics, etc., having up to 15 carbon atoms.Inorganic and ceramic coating materials typically comprise oxide,nitride, carbide, boride, or combinations thereof of elements of GroupsIIA, IIIA, IVA, VA, VIA, VIIA, IB, and IIB; metals of Groups IIIB, IVB,and VB, and rare-earth metals. For example, silicon carbide can bedeposited onto a substrate by recombination of plasmas generated fromsilane (SiH₄) and an organic material, such as methane or xylene.Silicon oxycarbide can be deposited from plasmas generated from silane,methane, and oxygen or silane and propylene oxide. Silicon oxycarbidealso can be deposited from plasmas generated from organosiliconeprecursors, such as tetraethoxysilane (TEOS), hexamethyldisiloxane(HMDSO), hexamethyldisilazane (HMDSN), or octamethylcyclotetrasiloxane(D4). Silicon nitride can be deposited from plasmas generated fromsilane and ammonia. Aluminum oxycarbonitride can be deposited from aplasma generated from a mixture of aluminum titrate and ammonia. Othercombinations of reactants, such as metal oxides, metal nitrides, metaloxynitrides, silicon oxide, silicon nitride, silicon oxynitrides may bechosen to obtain a desired coating composition.

Further, the bather coating 14 may comprise hybrid organic/inorganicmaterials or multilayer organic/inorganic materials. The inorganicmaterials may be chosen from A-F elements and the organic materials maycomprise acrylates, epoxies, epoxyamines, xylenes, siloxanes, silicones,etc. The choice of the particular reactants can be appreciated by thoseskilled in the art. Most metals may also be suitable for the barriercoating 14 in applications where transparency of the flexible substrate12 is not required. As can be appreciated, the flexible substrate 12 maycomprise a composition, which incorporates the barrier coating 14 toprovide a hermetic substrate.

The organic package 10 also includes an organic electronic device 16coupled to the barrier coating 14. The organic electronic device 16 maycomprise an OLED or OPV, for instance. The organic electronic device 16generally includes a number of organic semiconductor layers disposedbetween two conductors or electrodes. Accordingly, while not illustratedin FIG. 1, the electrodes of the organic electronic device 16 areelectrically coupled to an external current source, which is used toinitiate the light producing reactions in the organic electronic device16.

To provide hermeticity about the perimeter of the organic electronicdevice 16, a sealant 18 is coupled to the barrier coating 14. Thesealant 18 is disposed about the entire perimeter of the organicelectronic device 16 such that the organic electronic device 16 iscompletely surrounded by the sealant 18. Techniques for disposing thesealant 18 will be described further herein with reference to FIG. 2.The sealant 18 preferably comprises an adhesive material such that itmay be implemented to couple the flexible substrate 12 (and barriercoating 14) to the superstrate 20, thereby completely enclosing theorganic electronic device. Accordingly, the sealant 18 may compriseepoxies, acrylates, Norland 68 UV curables, thermally curable adhesives,pressure sensitive adhesives, such as thermosets and thermo-plasts orroom temperature vulcanized (RTV) adhesives, for instance. The sealant18 generally comprises any material having a low permeability andproviding adhesion.

Finally, the organic package 10 includes a superstrate 20 which may becoupled to the flexible substrate 12 by the sealant 18. As used herein,“superstrate” simply refers to the upper substrate of the organicpackage 10. Accordingly, the tern “superstrate” may be usedinterchangeably with “second substrate,” “upper substrate,” “topsubstrate,” or the like. To provide hermeticity, and flexibility, thesuperstrate 20 generally comprises a thin material having a lowpermeability. The superstrate 20 may or may not be transparent,depending on the application. In one embodiment, the superstrate 20comprises a reflective material, such as a metal foil, to reflect lightproduced by the organic electronic device 16. The superstrate 20 maycomprise aluminum foil, stainless steel foil, copper foil, tin, Kovar,Invar, etc. In applications where reflective light is less critical, thesuperstrate 20 may comprise thin glass, sapphire, mica or barrier coatedplastics having a low permeability.

The reflective superstrate 20 may be implemented to reflect anyradiation emitted away from the substantially transparent flexiblesubstrate 12 and direct such radiation toward the flexible substrate 12such that the total amount of radiation emitted in this direction isincreased. Advantageously, the superstrate 20 may comprise a material toprevent diffusion of reactive environmental elements, such as oxygen andwater, into the organic electronic device 16. The superstrate 20 issufficiently thin so as not to reduce the flexibility of the entiredevice. Further, the superstrate 20 may include a number of layers ofvarious metals or metal compound to further reduce the diffusion ofoxygen and water vapor into the organic electronic device 16. In oneembodiment, the inner layer of the superstrate 20, directly adjacent tothe organic electronic device 16, is reflective while the outer layerscomprise non-reflective materials or compounds such as metal oxides,nitrides, carbides, oxynitrides, or oxycarbides which may be implementedto reduce the rate of diffusion of oxygen and water into the organicelectronic device 16.

FIG. 2 illustrates an exemplary technique for fabricating a number oforganic packages, such as the organic package 10 discussed withreference to FIG. 1. As will be appreciated, the flexible substrate 12may be fed from a polymer film roll. In one exemplary embodiment, theroll may be sized such that two organic packages 10 can be fabricatedadjacent to one another, as illustrated in FIG. 2. The flexiblesubstrate 12 is coated with the barrier coating 14 and organicelectronic devices 16 may be arranged thereon. The superstrate 20 mayalso be fed from a roll. In the present exemplary embodiment, thesealant 18 is disposed onto the surface of the superstrate 20 to formthe seal around the entire periphery of the organic electronic device,once the superstrate 20 is coupled to the flexible substrate 12. Thesealant 18 may be screen printed, inkjet printed, lamintated or disposedonto the surface of the superstrate 20 by any other suitable means. Asillustrated in FIG. 2, the sealant 18 is arranged such that it willsurround the organic electronic device 16 once the rolled superstrate 20is coupled to the substrate 12. Once roll-to-roll manufacturing iscompleted, the organic devices 10 may be excised from the rolls. As willbe appreciated, other fabrication techniques may be implemented toconstruct the organic devices 10.

FIG. 3 illustrates an alternate embodiment of an organic package 22having hermetically sealed edges. As with the embodiment illustrated inFIG. 1, the organic package 22 includes a flexible substrate 12, abarrier coating 14, an organic electronic device 16 and a sealant 18disposed about the periphery of the organic electronic device 16. Theorganic package 22 includes a superstrate 24 having a periphery adaptedto wrap around the edges of the organic package 22. That is to say, thesuperstrate 24 is larger than the flexible substrate 12. As used herein,“adapted to,” “configured to,” and the like refer to elements that aresized, arranged or manufactured to form a specified structure or toachieve a specified result. The superstrate 24 may comprise aluminumfoil, stainless steel foil, copper foil, tin, Kovar, Invar, etc. Thesuperstrate 24 may be insulative or conductive. If the superstrate 24 isconductive, the organic package 22 may be configured such that thesuperstrate 24 may provide a bus-bar contact to the organic electronicdevice 16.

The superstrate 24 includes edges 26 which are sized such that they canbe wrapped around the edges of the flexible substrate 12 and coupled tothe frontside of the flexible substrate 12 (i.e., the side of theflexible substrate 12 that is opposite to the side having the organicelectronic device 16 attached thereto). The edges 26 of the superstrate24 may be adhesively coupled to the frontside of the flexible substrate12 using a sealant 28. The sealant 28 may comprise the same material asthe sealant 18. Alternatively, the sealant 28 may comprise a differentmaterial than the sealant 18. As can be appreciated, to effectivelyprotect the organic electronic device 16 from moisture and oxygen, thesealant 28 advantageously comprises a material having a lowpermeability.

The organic package 22 may be fabricated similarly to the processdescribed with reference to FIG. 2. Roll-to-roll techniques may beimplemented during initial fabrication of the organic package 22. Theonly difference in the processing is that enough spacing between theprinted sealant 18 should be provided such that the superstrate 20 canbe molded around the edges of the organic electronic device 16 andaround the edges and attached to the frontside of the flexible substrate12 once the organic devices 16 have been excised from the roll.

To further provide hermeticity to the organic package 22, a desiccant orgetter material may be disposed within the pockets created by wrappingthe edges 26 of the superstrate 24. As can be appreciated, the desiccantcomprises a material having a high affinity for water or oxygen and isimplemented as a drying agent. The desiccant or getter 30 advantageouslyabsorbs moisture or oxygen thereby further protecting the organicelectronic device 16. The desiccant or getter 30 may comprise calciumoxide, silica gel, Hisil, Zeolite, calcium sulfate (DRIERITE), bariumoxide, or other reactive metals for instance. As can be appreciated, thedesiccant or getter 30 may be omitted.

FIG. 4 illustrates another alternate embodiment of an organic package 32having hermetically sealed edges. As with the embodiment illustrated inFIGS. 1 and 3, the organic package 32 includes a flexible substrate 12,a barrier coating 14, an organic electronic device 16 and a sealant 18disposed about the periphery of the organic electronic device 16. In thepresent exemplary embodiment, rather than implementing a reflectivesuperstrate, a second flexible substrate 34, similar to the firstflexible substrate and having a barrier coating 36 thereon may bedisposed on the sealant 18. Once the second flexible substrate 34 iscoupled to the first flexible substrate 12, the edges may be sealed byimplementing flexible edge seals 38 to provide improved hermeticity. Theedge seals 38 may comprise aluminum foil, stainless steel foil, copperfoil, tin, Kovar, Invar, etc. and may be insulative or conductive. Theflexible edge seals 38 are coupled to the substrate 12 via a sealant 28and coupled to the substrate 34 via a sealant 40. The flexible edgeseals 38 may provide a more robust organic package since cracks in thehermetic coating of a flexible superstrate, for instance, areeliminated. As with the exemplary embodiment described with reference toFIG. 3, a desiccant or getter material 30 may be disposed within thepockets created by wrapping the edge seals 38 around the edges of theorganic package 32.

FIGS. 1-4 provide a description of a flexible substrate having anorganic device fabricated thereon and configured to provide improvedhermeticity. As described above, the flexible substrate 12 describedabove with reference to FIGS. 1-4 may comprise a composite of materials.Two exemplary composite substrates are illustrated and briefly describedwith reference to FIGS. 5 and 6. As will be appreciated, the layersdescribed with reference to FIGS. 5 and 6 are best understood withreference to the description provided above with reference to FIG. 1.

FIG. 5 illustrates a flexible substrate 42 having a composite structure.The substrate 42 includes a substantially transparent flexible film 44having a thickness in the range of approximately 0.25-50.0 mils, andpreferably in the range of approximately 0.5-10.0 mils The film 44 maybe dispensed from a roll, for example. The film has an index ofrefraction in the range of approximately 1.05-2.5, and preferably in therange of approximately 1.1-1.6. Further, the film 44 generally comprisesany flexibly suitable polymeric material. For instance, the film 44 maycomprise polycarbonates, polyarylates, polyetherimides,polyethersulfones, polyimides, such as Kapton H or Kapton E (made byDupont) or Upilex (made by UBE Industries, Ltd.), polynorbornenes, suchas cyclic-olefins (COC), liquid crystal polymers (LCP), such aspolyetheretherketone (PEEK), polyethylene terephthalate (PET), andpolyethylene naphtalate (PEN).

To provide hermeticity, the film 44 is coated with a transparent barriercoating 46 to prevent moisture and oxygen diffusion through the film 44and to an organic electronic device (not shown). The bather coating 46may be disposed or otherwise formed on the surface of the film 44. Thebarrier coating 46 may comprise any suitable reaction or recombinationproducts for reacting species. The barrier coating 46 may be disposed ata thickness in the range of approximately 10 nm to about 10,000 nm, andpreferably in the range of approximately 10 nm to about 1,000 nm. It isgenerally desirable to choose a coating thickness that does not impedethe transmission of light through the film 44, such as a barrier coating46 that causes a reduction in light transmission of less than about 20%,and preferably less than about 5%. The coating may be disposed by anysuitable deposition techniques, such as plasma-enhanced chemical-vapordeposition (PECVD), for example.

As described in FIG. 1 with reference to the barrier coating 14, thebarrier coating 46 may comprise organic, inorganic or ceramic materials,for instance. The materials are reaction or recombination products ofreacting plasma species and are deposited onto the surface of the film44. Organic coating materials may comprise carbon, hydrogen, oxygen andoptionally, other minor elements, such as sulfur, nitrogen, silicon,etc., depending on the types of reactants. Suitable reactants thatresult inorganic compositions in the coating are straight or branchedalkanes, alkenes, alkynes, alcohols, aldehydes, ethers, alkylene oxides,aromatics, etc., having up to 15 carbon atoms. Inorganic and ceramiccoating materials typically comprise oxide, nitride, carbide, boride, orcombinations thereof of elements of Groups IIA, IIIA, IVA, VA, VIA,VIIA, IB, and IIB; metals of Groups IIIB, IVB, and VB, and rare-earthmetals. For example, silicon carbide can be deposited onto a substrateby recombination of plasmas generated from silane (SiH₄) and an organicmaterial, such as methane or xylene. Silicon oxycarbide can be depositedfrom plasmas generated from silane, methane, and oxygen or silane andpropylene oxide. Silicon oxycarbide also can be deposited from plasmasgenerated from organosilicone precursors, such as tetraethoxysilane(TEOS), hexamethyldisiloxane (HMDSO), hexamethyldisilazane (HMDSN), oroctamethylcyclotetrasiloxane (D4). Silicon nitride can be deposited fromplasmas generated from silane and ammonia. Aluminum oxycarbonitride canbe deposited from a plasma generated from a mixture of aluminum titrateand ammonia. Other combinations of reactants, such as metal oxides,metal nitrides, metal oxynitrides, silicon oxide, silicon nitride,silicon oxynitrides may be chosen to obtain a desired coatingcomposition.

Further, the barrier coating 46 may comprise hybrid organic/inorganicmaterials or multilayer organic/inorganic materials. The inorganicmaterials may be chosen from A-F elements and the organic materials maycomprise acrylates, epoxies, epoxyamines, xylenes, siloxanes, silicones,etc. The choice of the particular reactants can be appreciated by thoseskilled in the art.

The substrate 42 may also comprise a coating or protective layer 48 thatis chemically resistant and has a low coefficient of thermal expansion(“CTE”). The protective layer 48 may be implemented to advantageouslyprevent the underlying materials from being chemically attacked bychemicals commonly used during fabrication of the substrate 42 or theorganic package. Further, because of the low CTE, the protective layer48 also allows processing of the substrate 42 at high temperatures. Theprotective layer 48 may comprise acrylates, epoxies, epoxyamines,xylenes, siloxanes, silicones, etc. potentially filled with inorganicfillers such a silica particles, for instance and may be deposited by aroll coating, slot coating, bar coating, spincoating, and other knownwet chemical coating techniques. Alternatively the protective layer 48may comprise inorganic and ceramic coating materials which typicallycomprise oxide, nitride, carbide, boride, or combinations thereof ofelements from Groups IIA, IIIA, IVA, VA, VIA, VIIA, IB, and IIB, ormetals from Groups IIIB, IVB, and VB, and rare-earth metals, which canbe deposited with deposition techniques, such as plasma-enhancedchemical-vapor deposition (PECVD), radio-frequency plasma-enhancedchemical-vapor deposition (RFPECVD), expanding thermal-plasmachemical-vapor deposition (ETPCVD), reactive sputtering,electron-cyclodrawn-residence plasma-enhanced chemical-vapor deposition(ECRPECVD), inductively coupled plasma-enhanced chemical-vapordeposition (ICPECVD), sputter deposition, evaporation, atomic layerdeposition (ALD), or combinations thereof.

The outer surface of the composite substrate 42 may include also includea protective layer 52. The protective layer 52 generally comprises alayer/coating that is abrasion resistant and has a low coefficient ofthermal expansion. The layer 52 may be implemented to prevent thesubstrate 42 from being scratched when handling. Further, because of thelow CTE, the protective layer 52 also allows processing of the substrate42 at high temperatures. The protective layer 52 may comprise any ofthose materials described above with respect to layer 48 and may bedeposited by any of the deposition techniques described above withregard thereto.

FIG. 6 illustrates yet another embodiment of a flexible substrate 54which may be implemented in accordance with the previously describedsealing techniques. The composite substrate 54 illustrated in FIG. 6 issimilar to the substrate illustrated with respect to FIG. 5. Thedifference between the substrate 54 and the substrate 42 is the use oftwo layers of film 56 and 58 (as opposed to one layer of film 44, as inFIG. 5) and two layers of barrier coating 60 and 62 (as opposed to onebather coating layer 46, as in FIG. 5). The barrier coating 60 iscoupled to the barrier coating 62 through an adhesive layer 64.

While the composite substrates 42 and 54 may be implemented to form anyof the organic packages described above with reference to FIGS. 1-4, yetanother embodiment, illustrated with reference to FIG. 7 may beimplemented to provide an organic package. Referring now to FIG. 7, anorganic package 66 is illustrated wherein the substrate described withreference to FIG. 6 is implemented. As will be appreciated, othersubstrate embodiments, such as the embodiment described with referenceto FIG. 5, may also be used in conjunction with the edge sealingconfiguration illustrated in FIG. 7. As described further below, theembodiment illustrated in FIG. 7 implements a structure wherein thesubstrates are individually sealed.

The organic package 66 includes two composite substrates 68 and 70. Eachcomposite substrate may have the structure described with reference toFIG. 6, for example. After fabrication of the substrates 68 and 70, theedges of each substrate 68 and 70 may be sealed by implementingrespective flexible edge seals 72 and 74 to provide improvedhermeticity. The edge seals 72 and 74 may comprise aluminum foil,stainless steel foil, copper foil, tin, Kovar, Invar, etc. and may beinsulative or conductive. As will be appreciated, one of the substrates(here, the substrate 70) may include an anode layer 76 of the organicelectronic device 78. The anode layer 76 may be deposited and patterneddirectly on the substrate 70. As will be appreciated, the anode layer 76is implemented to inject positive charge carriers (or holes) intoorganic layers of the organic electronic device 78 and is made of amaterial having a high work function; e.g., greater than about 4.5 eV,preferably from about 5 eV to about 5.5 eV. For instance, indium tinoxide (“ITO”) may be used to form the anode 76. ITO is substantiallytransparent to light transmission and allows at least 80% lighttransmitted therethrough. Therefore, light emitted from organicelectroluminescent layers of the organic electronic device can easilyescape through the ITO anode layer 76 without being seriouslyattenuated. Other materials suitable for use as the anode layer 76 aretin oxide, indium oxide, zinc oxide, indium zinc oxide, cadmium tinoxide, and mixtures thereof. In addition, materials used for the anodemay be doped with aluminum or fluorine to improve charge injectionproperty. The anode layer 76 may be deposited on the underlyingstructure by physical vapor deposition, chemical vapor deposition, ionbeam-assisted deposition, or sputtering. A thin, substantiallytransparent layer of a metal is also suitable. Alternatively, the anodelayer 76 may be part of the organic electronic device 78 which is lattercoupled to the substrate 70.

The flexible edge seals 72 and 74 are coupled to the respectivesubstrates 68 and 70 via a sealant 80. Once the edge seals 72 and 74 areattached to the substrates 68 and 70 and the organic electronic device78 is attached to the substrate 68, the substrates 68 and 70 may becoupled together via an another sealant layer 82. Each of the sealants80 and 82 may be disposed about the entire perimeter of the organicelectronic device 78 such that the organic electronic device 78 iscompletely surrounded by the sealants 80 and 82, as previously describedwith reference to FIGS. 1 and 2. The sealants 80 and 82 preferablycomprise an adhesive material such that the sealant 80 may beimplemented to couple the flexible edge seals 72 and 74 to therespective substrates 68 and 70 and the sealant 82 may be implemented tocouple the substrates 68 and 70 to one another. Accordingly, thesealants 80 and 82 may comprise epoxies, acrylates, Norland 68 UVcurables, thermally curable adhesives, pressure sensitive adhesives,such as thermosets and thermo-plasts or room temperature vulcanized(RTV) adhesives, for instance. Alternatively, the edge seals may besoldered or welded together, whereby the solder or weld reaction productwill act as the sealant 82. The sealants 80 and 82 generally compriseany material having a low permeability and providing adhesion. Aspreviously described, a desiccant or getter material 84 may be disposedwithin the pockets created by wrapping the edge seals 72 and 74 aroundthe edges of the substrates 68 and 70.

While the invention may be susceptible to various modifications andalternative forms, specific embodiments have been shown by way ofexample in the drawings and have been described in detail herein.However, it should be understood that the invention is not intended tobe limited to the particular forms disclosed. Rather, the invention isto cover all modifications, equivalents, and alternatives falling withinthe spirit and scope of the invention as defined by the followingappended claims.

1. A package comprising: a first substrate comprising a flexiblesubstrate comprising a polymeric transparent film; an organic electronicdevice coupled to the transparent film; a sealant coupled to thetransparent film and disposed about the perimeter of the organicelectronic device; a second substrate comprising a superstrate coupledto the sealant and disposed proximate the organic electronic device; andan edge seal coupled to each of the flexible substrate and thesuperstrate and configured to hermetically seal peripheral edges of thepackage.
 2. The package, as set forth in claim 1, wherein the flexiblesubstrate comprises the bather coating.
 3. The package, as set forth inclaim 1, wherein the flexible substrate is a composite substratecomprising: a first protective layer configured to resist abrasion; apolymeric transparent film coupled to the first protective layer; abarrier coating coupled to the transparent film; and a second protectivelayer coupled to the barrier coating and configured to protect thetransparent film from chemical attach during fabrication.
 4. Thepackage, as set forth in claim 1, wherein the flexible substrate is acomposite substrate comprising: a first protective layer configured toresist abrasion; a first polymeric transparent film coupled to the firstprotective layer; a first bather coating coupled to the firsttransparent film; a second barrier coating coupled to the first barriercoating via an adhesive layer; a second polymeric transparent filmcoupled to the second barrier coating; and a second protective layercoupled to the barrier coating and configured to protect the transparentfilm from chemical attach during fabrication.
 5. The package, as setforth in claim 1, comprising a barrier coating coupled between theflexible substrate and the organic electronic device.
 6. The package, asset forth in claim 1, wherein the organic electronic device comprises anorganic light emitting diode.
 7. The package, as set forth in claim 1,wherein the organic electronic device comprises an organic photovoltaicdevice.
 8. The package, as set forth in claim 1, wherein the sealantcomprises an adhesive material having a low permeability.
 9. Thepackage, as set forth in claim 1, wherein the sealant comprises athickness that is greater than a thickness of the organic electronicdevice.
 10. The package, as set forth in claim 1, wherein thesuperstrate comprises a metal foil.
 11. The package, as set forth inclaim 1, comprising a desiccant material disposed within pockets formedby the edge seal.
 12. The package, as set forth in claim 1, wherein theedge seal comprises a metal foil.
 13. A package comprising: a firstsubstrate, wherein peripheral edges of the first substrate are coveredwith a first edge seal configured to hermetically seal peripheral edgesof the first substrate; an organic electronic device disposed on thefirst substrate; and a second substrate disposed proximate to theorgainic electronic device and coupled to the first substrate via asealant.
 14. The package, as set forth in claim 13, wherein theperipheral edges of the second substrate are covered with a second edgeseal configured to hermetically seal peripheral edges of the secondsubstrate.
 15. The package, as set forth in claim 13, wherein each ofthe first substrate and the second substrate comprises a compositesubstrate.
 16. The package, as set forth in claim 13, wherein the firstsubstrate is a composite substrate comprising: a first protective layerconfigured to resist abrasion; a polymeric transparent film coupled tothe first protective layer; a barrier coating coupled to the transparentfilm; and a second protective layer coupled to the barrier coating andconfigured to protect the transparent film from chemical attach duringfabrication.
 17. The package, as set forth in claim 13, wherein thefirst substrate is a composite substrate comprising: a first protectivelayer configured to resist abrasion; a first polymeric transparent filmcoupled to the first protective layer; a first barrier coating coupledto the first transparent film; a second barrier coating coupled to thefirst barrier coating via an adhesive layer; a second polymerictransparent film coupled to the second bather coating; and a secondprotective layer coupled to the barrier coating and configured toprotect the transparent film from chemical attach during fabrication.18. The package, as set forth in claim 13, wherein the sealant comprisesan adhesive material having a low permeability.
 19. The package, as setforth in claim 13, wherein the first edge seal comprises a metal foil.20. A package comprising: a first composite substrate, whereinperipheral edges of the first composite substrate are covered with afirst edge seal; a second composite substrate, wherein peripheral edgesof the second composite substrate are covered with a second edge seal;and an organic electronic device disposed between the first compositesubstrate and the second composite substrate, wherein the firstcomposite substrate is coupled to the second composite substrate via asealant.
 21. The package, as set forth in claim 20, wherein each of thefirst composite substrate and the second composite substrate comprises:a first protective layer configured to resist abrasion; a polymerictransparent film coupled to the first protective layer; a barriercoating coupled to the transparent film; and a second protective layercoupled to the barrier coating and configured to protect the transparentfilm from chemical attach during fabrication.
 22. The package, as setforth in claim 20, wherein each of the first composite substrate and thesecond composite substrate comprises: a first protective layerconfigured to resist abrasion; a first polymeric transparent filmcoupled to the first protective layer; a first barrier coating coupledto the first transparent film; a second barrier coating coupled to thefirst barrier coating via an adhesive layer; a second polymerictransparent film coupled to the second barrier coating; and a secondprotective layer coupled to the barrier coating and configured toprotect the transparent film from chemical attach during fabrication.23. The package, as set forth in claim 20, wherein the organicelectronic device comprises an organic light emitting diode.
 24. Thepackage, as set forth in claim 20, wherein the organic electronic devicecomprises an organic photovoltaic device.
 25. The package, as set forthin claim 20, wherein the sealant comprises an adhesive material having alow permeability.
 26. The package, as set forth in claim 20, comprisinga desiccant material disposed within pockets formed by each of the edgeseals.
 27. The package, as set forth in claim 20, wherein each of theedge seals comprises a metal foil.